The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10367131 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 30, 2019

Filed:

May. 31, 2018
Applicant:

Sridhar Kasichainula, Fremont, CA (US);

Inventor:

Sridhar Kasichainula, Fremont, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 35/34 (2006.01); H01L 35/32 (2006.01); H01L 35/08 (2006.01); H01L 31/054 (2014.01); H02S 10/10 (2014.01); H01L 35/30 (2006.01); H02S 40/44 (2014.01); H02S 30/20 (2014.01);
U.S. Cl.
CPC ...
H01L 35/34 (2013.01); H01L 31/0547 (2014.12); H01L 35/08 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01); H02S 10/10 (2014.12); H02S 30/20 (2014.12); H02S 40/44 (2014.12); Y02E 10/52 (2013.01);
Abstract

A method includes forming a thin-film based thermoelectric module by sputter depositing pairs of N-type and P-type thermoelectric legs electrically in contact with one another on corresponding electrically conductive pads on a flexible substrate having a dimensional thickness less than or equal to 25 μm, with the legs having extended areas compared to the corresponding electrically conductive pads, and rendering the formed thin-film based thermoelectric module flexible and less than or equal to 100 μm in dimensional thickness based on choices of fabrication processes. The method also includes encapsulating the formed thin-film based thermoelectric module with an elastomer to render the flexibility thereto. The elastomer encapsulation has a dimensional thickness less than or equal to 15 μm, and the flexibility enables an array of thin-film based thermoelectric modules to be completely wrappable and bendable around a system element from which the array is configured to derive thermoelectric power.


Find Patent Forward Citations

Loading…