The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Dec. 29, 2016
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventor:
Yasumasa Kasuya, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4842 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 23/49866 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01);
Abstract
A semiconductor deviceincludes a semiconductor chip, a plurality of leads, disposed in a periphery of the semiconductor chip, and a sealing resin, sealing the semiconductor chipand the leadssuch that lower surfacesand outer end surfacesat sides opposite the semiconductor chipof the leadsare exposed. Lead plating layersarranged to improve solder wettability are formed on the lower surfacesand the outer end surfacesof the leads