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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10366933 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

Jul. 27, 2017

Case having terminal insertion portion for an external connection terminal

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Takuro Mori, Fukuoka, JP;

Hayato Nagamizu, Fukuoka, JP;

Yoshitaka Otsubo, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01R 9/00 (2006.01); H01L 21/00 (2006.01); H01L 23/10 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/049 (2006.01); H01L 23/495 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4875 (2013.01); H01L 21/56 (2013.01); H01L 23/049 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/49517 (2013.01); H01L 23/49555 (2013.01); H01L 23/49811 (2013.01);
Abstract

A semiconductor device includes: a base plate; an insulating substrate provided on an upper surface of the base plate; a conductive pattern provided on an upper surface of the insulating substrate; a semiconductor chip mounted on an upper surface of the conductive pattern; a case surrounding the base plate, the insulating substrate, the conductive pattern, and the semiconductor chip; a sealing resin sealing an interior of the case; and an external connection terminal provided to the case. One end portion of the external connection terminal is connected to the conductive pattern, the case has a terminal insertion portion enabling insertion of the other end portion of the external connection terminal in a peripheral wall portion thereof, and a portion of the external connection terminal other than the other end portion is sealed by the sealing resin with the other end portion being inserted in the terminal insertion portion.

Find Patent Forward Citations

Quick Actions:

Mori, Takuro. (2019). Case having terminal insertion portion for an external connection terminal (U.S. Patent No. 10366933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10366933

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