The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

May. 24, 2017
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Tung-Kai Liu, Miao-Li County, TW;

Tsau-Hua Hsieh, Miao-Li County, TW;

Bo-Feng Chen, Miao-Li County, TW;

Hui-Chieh Wang, Miao-Li County, TW;

Assignee:

Innolux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H05K 3/00 (2006.01); H01L 25/16 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/0079 (2013.01); H01L 33/62 (2013.01); H05K 1/115 (2013.01); H05K 3/0026 (2013.01); H05K 3/4038 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/95 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The current disclosure provides a pickup and placing device including a control element, a substrate and a pickup structure. The substrate has an upper surface and a lower surface opposite to each other and a plurality of conductive via structures, wherein the conductive via structures are electrically connected to the control element. The pickup structure includes a plurality of pickup heads used for picking up or placing a plurality of light emitting diodes respectively. The pickup structure is disposed on the lower surface of the substrate or disposed in the substrate and extended outside the substrate, and the substrate is disposed between the control element and the pickup structure, wherein the pickup heads are electrically connected to the conductive via structures.


Find Patent Forward Citations

Loading…