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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10366894 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

Mar. 11, 2016

Method of manufacturing semiconductor device, substrate processing device, and recording medium

Applicant:

Hitachi Kokusai Electric Inc., Tokyo, JP;

Inventors:

Yukinao Kaga, Toyama, JP;

Arito Ogawa, Toyama, JP;

Assignee:

KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Volpe and Koenig, P.C.

Primary Examiner:

Matthew L Reames

Assistant Examiner:

Benjamin Tzu-Hung Liu

Int. Cl.
CPC ...
H01L 21/28 (2006.01); C23C 16/32 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H01L 21/285 (2006.01); H01L 21/3205 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28088 (2013.01); C23C 16/32 (2013.01); C23C 16/455 (2013.01); C23C 16/45531 (2013.01); C23C 16/52 (2013.01); H01L 21/28562 (2013.01); H01L 21/32051 (2013.01);
Abstract

A method for manufacturing a semiconductor device, including: forming a metal carbide film including a first metal element and a second metal element on a substrate, by time-divisionally performing, supplying a first precursor gas containing the first metal element and not containing carbon to the substrate, supplying a second precursor gas containing the second metal element differing from the first metal element and not containing carbon to the substrate, and supplying a reaction gas containing carbon to the substrate.

Find Patent Forward Citations

Kaga, Yukinao. (2019). Method of manufacturing semiconductor device, substrate processing device, and recording medium (U.S. Patent No. 10366894). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10366894

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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