The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Jan. 17, 2019
Applicants:

Furukawa Electric Co., Ltd., Tokyo, JP;

Furukawa Magnet Wire Co., Ltd., Tokyo, JP;

Inventors:

Hideo Fukuda, Tokyo, JP;

Isao Tomomatsu, Tokyo, JP;

Makoto Oya, Tokyo, JP;

Daisuke Muto, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 7/02 (2006.01); H01B 3/30 (2006.01); H01F 41/12 (2006.01); H01B 13/14 (2006.01); H01B 3/44 (2006.01); H01F 5/06 (2006.01);
U.S. Cl.
CPC ...
H01B 7/0216 (2013.01); H01B 3/301 (2013.01); H01B 3/305 (2013.01); H01B 3/306 (2013.01); H01B 3/441 (2013.01); H01B 13/141 (2013.01); H01F 5/06 (2013.01); H01F 41/12 (2013.01);
Abstract

An insulated wire having a thermosetting resin layer on the outer periphery of a conductor and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer, wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 μm or more and 250 μm or less, and a degree of orientation of a thermoplastic resin in said thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less; a coil and an electric and electronic equipment each having the insulated wire. Formula 1 Degree of orientation H (%)=[(360−ΣW)/360]×100 W: A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction n: the number of orientation peak at a β angle of 0° or more and 360° or less.


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