The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Jan. 26, 2017
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Reuel B. Swint, Billerica, MA (US);

Gregory D. Allen, Somerville, MA (US);

Todd A. Thorsen, Carlisle, MA (US);

Boris G. Kharas, Needham, MA (US);

Donna-Ruth Webb Yost, Acton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 27/00 (2006.01); G05D 23/01 (2006.01); H05K 7/20 (2006.01); F28D 15/00 (2006.01); F28F 13/00 (2006.01); F28D 21/00 (2006.01); G05D 23/12 (2006.01);
U.S. Cl.
CPC ...
G05D 23/01 (2013.01); F28D 15/00 (2013.01); F28D 21/00 (2013.01); F28F 13/00 (2013.01); G05D 23/121 (2013.01); H05K 7/205 (2013.01); H05K 7/20254 (2013.01); F28D 2021/0029 (2013.01); F28F 2013/008 (2013.01);
Abstract

Electrical and electromechanical devices often require maintaining a specific temperature, or a narrow range or temperatures, during operation. An assembly regulates the temperature of a device by providing a variable thermal resistance between the device and a heatsink. The device can be mounted to a base having a high thermal resistance, the base thermally isolating the device from the heatsink. At low environmental temperatures, the base enables the device to rise to its operating temperature as a result of the device's waste heat, and with no or minimal use of a heater. As the environmental temperature increases, a working fluid, having a low thermal resistance, undergoes thermal expansion to fill a portion of a volume in the base between the device and the heat sink, lowering the thermal resistance between the device and the heatsink to maintain the device at the required operating temperature.


Find Patent Forward Citations

Loading…