The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Feb. 09, 2016
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); G03F 7/023 (2006.01); G03F 7/40 (2006.01); C08G 73/10 (2006.01); C08G 73/22 (2006.01); G03F 7/004 (2006.01); G03F 7/075 (2006.01); C08F 8/00 (2006.01); C08G 8/12 (2006.01); G03F 7/022 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C08F 8/00 (2013.01); C08G 8/12 (2013.01); C08G 73/10 (2013.01); C08G 73/106 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1053 (2013.01); C08G 73/22 (2013.01); G03F 7/004 (2013.01); G03F 7/0046 (2013.01); G03F 7/023 (2013.01); G03F 7/0226 (2013.01); G03F 7/0233 (2013.01); G03F 7/0236 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/075 (2013.01); G03F 7/0755 (2013.01); G03F 7/0757 (2013.01); G03F 7/161 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H01L 24/02 (2013.01); H01L 2224/024 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02379 (2013.01); H01L 2924/07025 (2013.01);
Abstract
Provided is a photosensitive resin composition containing: one or more kinds of alkali-soluble resins selected from a polyimide, a polybenzoxazole, a polyimide precursor, a polybenzoxazole precursor, and a copolymer formed of two or more polymers selected from the preceding substances; and a photosensitizer. The photosensitive resin composition further contains a compound represented by general formula (1). Even when a cured film is fired at low temperature, the photosensitive resin composition exhibits superior adhesion properties with metallic materials, particularly copper, and also exhibits high chemical resistance.