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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10365520 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

Sep. 03, 2012

Wiring structure for display device

Applicants:

Hiroyuki Okuno, Kobe, JP;

Toshihiro Kugimiya, Kobe, JP;

Inventors:

Hiroyuki Okuno, Kobe, JP;

Toshihiro Kugimiya, Kobe, JP;

Assignee:

Kobe Steel, Ltd., Kobe-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Anthony J Frost

Int. Cl.
CPC ...
H01L 23/532 (2006.01); G02F 1/1343 (2006.01); C22C 21/00 (2006.01); H01J 31/12 (2006.01); H01J 11/46 (2012.01); H01L 27/12 (2006.01); B32B 15/01 (2006.01); C23C 14/06 (2006.01); H01L 21/48 (2006.01); G02F 1/1362 (2006.01); C23C 14/00 (2006.01); C23C 14/02 (2006.01); C22C 14/00 (2006.01); C22C 27/02 (2006.01); C22C 27/04 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13439 (2013.01); B32B 15/016 (2013.01); B32B 15/017 (2013.01); C22C 14/00 (2013.01); C22C 21/00 (2013.01); C22C 27/02 (2013.01); C22C 27/04 (2013.01); C23C 14/0036 (2013.01); C23C 14/025 (2013.01); C23C 14/0641 (2013.01); G02F 1/136286 (2013.01); H01J 11/46 (2013.01); H01J 31/127 (2013.01); H01L 21/4885 (2013.01); H01L 23/53219 (2013.01); H01L 23/53223 (2013.01); H01L 27/124 (2013.01); G02F 2001/136295 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/10 (2015.01); Y10T 428/1095 (2015.01); Y10T 428/265 (2015.01); Y10T 428/31678 (2015.04);
Abstract

Provided is a wiring structure for display device which does not generate hillocks even when exposed to high temperatures at levels around 450 to 600° C., has excellent high-temperature heat resistance, keeps electrical resistance (wiring resistance) of the entire wiring structure low, and further has excellent resistance to hydrofluoric acid. This wiring structure for a display device comprises a structure in which are laminated, in order from the substrate side, a first layer of an Al alloy that contains at least one chemical element selected from the group (group X) consisting of Ta, Nb, Re, Zr, W, Mo, V, Hf, Ti, Cr, and Pt and contains at least one rare earth element, and a second layer of an Al alloy nitride, or a nitride of at least one chemical element selected from the group Y consisted of Ti, Mo, Al, Ta, Nb, Re, Zr, W, V, Hf, and Cr.

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