The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Feb. 28, 2018
Luxtera, Inc., Carlsbad, CA (US);
Attila Mekis, Carlsbad, CA (US);
Peter De Dobbelaere, San Diego, CA (US);
Gianlorenzo Masini, Carlsbad, CA (US);
Yannick De Koninck, San Diego, CA (US);
Thierry Pinguet, Arlington, WA (US);
Luxtera, Inc., Carlsbad, CA (US);
Abstract
Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. A continuous wave (CW) optical signal may be received in the photonic interposer from the light source assembly, and a modulated optical signal may be communicated between the optical fiber and photonic interposer. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.