The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Jan. 04, 2018
Applicant:

Rockley Photonics Limited, London, GB;

Inventors:

Gerald Cois Byrd, Shadows Hills, CA (US);

David Arlo Nelson, Fort Collins, CO (US);

Javid Messian, Sherman Oaks, CA (US);

Thomas Pierre Schrans, Temple City, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/13 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); F21V 8/00 (2006.01); G02B 6/122 (2006.01); H01S 5/026 (2006.01); G02B 6/14 (2006.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/13 (2013.01); G02B 6/0006 (2013.01); G02B 6/1225 (2013.01); G02B 6/14 (2013.01); G02B 6/428 (2013.01); G02B 6/4269 (2013.01); G02B 6/43 (2013.01); H01S 5/0261 (2013.01); G02B 2006/12061 (2013.01); H01S 5/021 (2013.01);
Abstract

A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.


Find Patent Forward Citations

Loading…