The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Jun. 09, 2016
Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Masanori Miyata, Kariya, JP;

Yoshifumi Okabe, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01R 31/2633 (2013.01); G01R 31/2886 (2013.01);
Abstract

A semiconductor element test apparatus includes a first switch having a switching element, a coil, a second switch, a semiconductor element, a first rectifying element, and a second rectifying element. The first switch, the coil, and the second switch are connected in series to a power source. The semiconductor element is disposed to configure a loop path along with the coil and the second switch when the switching element is switched off. The semiconductor element has a diode element. A cathode electrode of the diode element is connected to a positive electrode of the power source. The second rectifying element is connected to the first rectifying element in series, and has a rectification direction opposite to a rectification direction of the first rectifying element. The first rectifying element and the second rectifying element configure, along with the coil, another loop path which is different from the loop path.


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