The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Feb. 05, 2016
Applicants:

Jürgen-peter Herrmann, Rosenheim, DE;

Marius Michael Herrmann, Rosenheim, DE;

Wolfgang Schorn, Hönningen, DE;

Inventors:

Jürgen-Peter Herrmann, Rosenheim, DE;

Marius Michael Herrmann, Rosenheim, DE;

Wolfgang Schorn, Hönningen, DE;

Assignee:

KHS GmbH, Dortmund, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/88 (2006.01); G01N 21/958 (2006.01); G01N 21/86 (2006.01); B65H 26/06 (2006.01); B65H 26/02 (2006.01);
U.S. Cl.
CPC ...
G01N 21/8851 (2013.01); B65H 26/02 (2013.01); B65H 26/066 (2013.01); G01N 21/86 (2013.01); G01N 21/958 (2013.01); B65H 2511/512 (2013.01); B65H 2511/52 (2013.01); B65H 2553/42 (2013.01); B65H 2553/45 (2013.01); B65H 2557/51 (2013.01); B65H 2557/62 (2013.01); B65H 2557/64 (2013.01); B65H 2701/12 (2013.01); B65H 2701/173 (2013.01); G01N 2021/8663 (2013.01); G01N 2021/888 (2013.01); G01N 2201/06113 (2013.01);
Abstract

The present application relates to a tracking arrangement for the tracking of a material defect in a sheet material, such as a container material or a product-packaging material. The tracking arrangement may comprise a defect sensor, which is configured to detect a material defect in a sheet material moving thereby or therethrough. The tracking arrangement may also comprise a first structure sensor, which is configured to detect at least one inherent structural feature of the sheet material itself in the region of the material defect, as well as a control arrangement, which is configured to receive data from said first structure sensor.


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