The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Oct. 06, 2017
Applicant:
Fujifilm Planar Solutions, Llc, Mesa, AZ (US);
Inventor:
Deepak Mahulikar, Madison, CT (US);
Assignee:
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC., North Kingstown, RI (US);
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); H01L 21/768 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract
CMP compositions providing stable and robust polishing performance at elevated pad or wafer surface temperatures are disclosed, as well as methods for use thereof. The compositions of the disclosure include reaction rate optimizing (RRO) compounds that optimize various chemical reactions occurring in the slurry chemistry at elevated polishing temperatures on the wafer surface, such that removal rate variation within an individual wafer is <10%.