The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Mar. 22, 2012
Applicants:

Masao Tomioka, Toyohashi, JP;

Manabu Kaneko, Toyohashi, JP;

Miyuki Hagiwara, Toyohashi, JP;

Inventors:

Masao Tomioka, Toyohashi, JP;

Manabu Kaneko, Toyohashi, JP;

Miyuki Hagiwara, Toyohashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/04 (2006.01); H05K 5/00 (2006.01); C08J 5/24 (2006.01); C08G 59/32 (2006.01); C08K 5/21 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/04 (2013.01); C08G 59/3272 (2013.01); C08J 5/24 (2013.01); C08K 5/21 (2013.01); C08L 63/00 (2013.01); H05K 5/0091 (2013.01); C08J 2363/04 (2013.01); C08L 2205/02 (2013.01); Y10T 428/1352 (2015.01); Y10T 428/249945 (2015.04);
Abstract

To provide an epoxy-resin composition and prepreg for producing a fiber-reinforced composite material which exhibits excellent curability and has excellent flame retardance and heat resistance, as well as to provide fiber-reinforced composite materials produced using the prepreg and to provide housing for electronic/electrical devices. The epoxy resin composition contains component (A): a phosphorus compound; component (B): an epoxy resin which has at least three epoxy groups in the molecule, and which does not correspond to component (A) nor include component (A); component (C): an epoxy resin curing agent which does not have a urea structure in the molecule; and component (D): a dimethylurea compound represented by formula (a) (in formula (a), 'R' is a hydrogen atom or an alkyl group having any number of 1 to 10 carbons).


Find Patent Forward Citations

Tomioka, Masao. (2019). Epoxy resin composition, prepreg, fiber-reinforced composite material, and housing for electrical or electronic equipment (U.S. Patent No. 10364347). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10364347

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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