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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10364339 B1

PDFFull Text
Date of Patent:
Jul. 30, 2019

Filed:

Jun. 13, 2014

Polyamide resin composition and molded article produced therefrom

Applicant:

Kuraray Co., Ltd., Kurashiki-shi, JP;

Inventors:

Kozo Tamura, Chiyoda-ku, JP;

Hideaki Suzuki, Tsukuba, JP;

Shimon Kanai, Tsukuba, JP;

Assignee:

KURARAY CO., LTD., Kurashiki-shi, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Christopher M Rodd

Int. Cl.
CPC ...
C08K 5/5313 (2006.01); C08K 7/14 (2006.01); C08K 5/13 (2006.01); C08K 5/134 (2006.01); C08K 5/524 (2006.01); C08K 5/527 (2006.01); C08L 77/06 (2006.01); C08G 69/26 (2006.01); C08K 7/02 (2006.01); C08K 5/526 (2006.01);
U.S. Cl.
CPC ...
C08K 5/5313 (2013.01); C08G 69/26 (2013.01); C08K 5/13 (2013.01); C08K 5/524 (2013.01); C08K 5/526 (2013.01); C08K 5/527 (2013.01); C08K 7/02 (2013.01); C08L 77/06 (2013.01); C08K 5/134 (2013.01); C08K 7/14 (2013.01);
Abstract

A polyamide resin composition includes: 100 parts by mass of (A) a polyamide having a melting point of 280 to 330° C.; 0.5 to 80 parts by mass of (B) aluminum diethylphosphinate; 0.2 to 2 parts by mass of (C) at least one phosphorous acid ester represented by formula (6) or (7); and (E) at least one reinforcing material. A mass ratio of the at least one phosphinic acid salt (B) to the at least one phosphorous acid ester (C) ((B)/(C)) is in a range of from 10 to 100. An average particle diameter of the phosphinic acid salt (B) is 0.1 to 100 μm. The polyamide resin composition does not comprise a metallic soap-based lubricant.

Find Patent Forward Citations

Tamura, Kozo. (2019). Polyamide resin composition and molded article produced therefrom (U.S. Patent No. 10364339). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10364339

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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