The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Oct. 24, 2017
Applicant:

Sumitomo Bakelite Company Limited, Tokyo, JP;

Inventors:

Takafumi Sumiyoshi, Tokyo, JP;

Hiroshi Shibata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01J 2/00 (2006.01); C01B 33/18 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C01B 33/18 (2013.01); B01J 2/006 (2013.01); C01P 2004/61 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Particle production apparatusincluding processing sectionin which a processing liquid is adhered to a surface of each of inorganic particles contained in a powder material, chamberconnected to processing sectionat a downstream side thereof in which the powder material is separated from gas carrying the material, powder material supply devicewith supply portionand supply unitfor supplying the powder material into processing section, and processing liquid spraying devicehaving a nozzle, a pump, a supply unitfor supplying the processing liquid, and a high-pressure gas (air) generating unit. Processing liquid spraying deviceis configured to spray processing liquid as droplets onto the powder material just after the powder material being supplied into the processing section. Preferably, a volume of the processing sectionis smaller than a volume of the chamber


Find Patent Forward Citations

Sumiyoshi, Takafumi. (2019). Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition (U.S. Patent No. 10364153). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10364153

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…