The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Jul. 22, 2014
Applicant:

Assa Abloy Ab, Stockholm, SE;

Inventors:

Ted M. Hoffman, Eden Prairie, MN (US);

Brent D. Lien, Minneapolis, MN (US);

Assignee:

ASSA ABLOY AB, Stockholm, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2019.01); B32B 7/12 (2006.01); B44C 3/00 (2006.01); B32B 27/10 (2006.01); B32B 37/00 (2006.01); B32B 37/06 (2006.01); B32B 37/26 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
B32B 37/025 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/10 (2013.01); B32B 37/0015 (2013.01); B32B 37/06 (2013.01); B32B 38/0036 (2013.01); B32B 38/10 (2013.01); B32B 38/145 (2013.01); B32B 38/18 (2013.01); B44C 3/005 (2013.01); B32B 2037/268 (2013.01); B32B 2307/748 (2013.01); B32B 2309/70 (2013.01); B32B 2425/00 (2013.01); B32B 2429/00 (2013.01); Y10T 156/171 (2015.01);
Abstract

Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.


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