The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 30, 2019
Filed:
Oct. 14, 2015
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Takuya Teranishi, Tokyo, JP;
Akira Oota, Tokyo, JP;
Masahiro Ichino, Tokyo, JP;
Toru Kondo, Tokyo, JP;
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Abstract
A resin composition including an epoxy resin (A), a curing agent (B), and vinyl polymer particles (C), in which the contained amount of epoxy resin (a1) having a molecular weight of 100-480 is 30-90 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of epoxy resin (a2) having a molecular weight of 2,000-40,000 is 10-70 parts by mass per 100 parts by mass of the epoxy resin (A), the contained amount of the vinyl polymer particles (C) is 2-30 parts by mass per 100 parts by mass of the epoxy resin (A), and the instantaneous maximum thickening value of the vinyl polymer particles obtained by the following method is 0.3-5.0 Pa·s/° C.