The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 30, 2019

Filed:

Sep. 13, 2016
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Fabian Gubelmann, Buchs, CH;

Dariusz Oliwiusz Palys, Gebenstorf, CH;

Ernst Vogt, Remigen, CH;

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B26F 3/00 (2006.01); B33Y 40/00 (2015.01); B22F 3/24 (2006.01); B33Y 80/00 (2015.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
B26F 3/00 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); B33Y 40/00 (2014.12); B33Y 80/00 (2014.12); B22F 2003/247 (2013.01); B22F 2999/00 (2013.01); Y02P 10/295 (2015.11);
Abstract

Aspects of the disclosure include a machine and system for support removal and a laser-sintered component compatible with same. A laser-sintered component may have a component surface and at least one laser-sintered support extending from the component surface. A press may move a cutting surface along a cutting path adjacent to the component surface. The cutting surface has a shape complementary to the component surface and at least one cutting edge positioned to separate at least one laser-sintered support from the component surface as the cutting surface moves along the cutting path.


Find Patent Forward Citations

Loading…