The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Sep. 23, 2015
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Tsutomu Yasui, Tokyo, JP;
Hisayuki Abe, Tokyo, JP;
Kenichi Kawabata, Tokyo, JP;
Tomoko Kitamura, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 19/03 (2006.01); C22C 13/00 (2006.01); B23K 35/30 (2006.01); B23K 35/26 (2006.01); B23K 35/02 (2006.01); B32B 15/01 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3463 (2013.01); B23K 35/025 (2013.01); B23K 35/0227 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/3033 (2013.01); C22C 13/00 (2013.01); C22C 19/03 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19105 (2013.01); H05K 3/3484 (2013.01);
Abstract
First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.