The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Sep. 22, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Ann M. Gilman, Woodbury, MN (US);

Mikhail L. Pekurovsky, Bloomington, MN (US);

Matthew S. Stay, Minneapolis, MN (US);

Shawn C. Dodds, St. Paul, MN (US);

Daniel J. Theis, Mahtomedi, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); G06F 3/041 (2006.01); G02F 1/1333 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H01L 29/06 (2006.01); H01L 21/8238 (2006.01); H05K 1/09 (2006.01); B82Y 15/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H05K 3/285 (2013.01); G02F 1/13338 (2013.01); G06F 3/041 (2013.01); H05K 1/0296 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); B82Y 15/00 (2013.01); B82Y 40/00 (2013.01); G02F 2001/133302 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04107 (2013.01); H01L 21/823871 (2013.01); H01L 29/0669 (2013.01); H05K 1/097 (2013.01); H05K 2203/1377 (2013.01); Y10S 977/762 (2013.01); Y10S 977/89 (2013.01); Y10S 977/956 (2013.01);
Abstract

A method for making an electronic assembly includes applying a protective layer including an organosulfur compound to at least a portion of a patterned conductive interconnect circuit, wherein the conductive interconnect circuit overlies at least a portion of a conductive layer on a substrate, and wherein the conductive layer includes nanowires; and engaging an electrical contact of an electronic component with the protective layer to electrically connect the electronic component and the patterned conductive layer.


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