The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Nov. 29, 2016
Applicant:
Jx Nippon Mining & Metals Corporation, Chiyoda-ku, Tokyo, JP;
Inventor:
Satoru Endo, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/03 (2006.01); C25D 5/20 (2006.01); C25D 7/00 (2006.01); B32B 15/01 (2006.01); H01R 12/58 (2011.01); C25D 3/12 (2006.01); C25D 5/34 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); B32B 15/01 (2013.01); C25D 5/20 (2013.01); C25D 7/00 (2013.01); H01R 12/585 (2013.01); B32B 2457/00 (2013.01); C25D 3/12 (2013.01); C25D 5/34 (2013.01);
Abstract
The present invention provides a Ni-plated copper or copper alloy material having both excellent hardness and excellent bendability. In the Ni-plated copper or copper alloy material having, an area ratio of a crystal having <001> plane orientation in a crystal plane parallel to a surface of a Ni plating, measured by an electron backscatter diffraction, is 15 to 35%.
Quick Actions:
Endo, Satoru. (2019). Ni-plated copper or copper alloy material, connector terminal, connector and electronic component using the same (U.S. Patent No. 10361501). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10361501
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile