The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Mar. 11, 2016
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Wey-Jiun Lin, Los Altos Hills, CA (US);

Sang Youn, Cupertino, CA (US);

Sang Ha Kim, Dublin, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 27/32 (2006.01); H05K 1/02 (2006.01); H01L 51/52 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); H01L 27/3244 (2013.01); H01L 27/3262 (2013.01); H01L 51/5237 (2013.01); H01L 51/5246 (2013.01); H05K 1/0281 (2013.01); H01L 2227/32 (2013.01); H01L 2251/5338 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01); Y02E 10/549 (2013.01);
Abstract

An electronic device may be provided with a display such as an organic light-emitting diode display. The display may include an array of display pixels formed on a polymer substrate layer. The polymer substrate layer may include an contiguous layer of polyimide that forms a substrate layer in additional structures such as a polymer film and a flexible printed circuit. A first transition region may be interposed between the display and the polymer film, and a second transition region may be interposed between the polymer film and the flexible printed circuit. Metal traces may be formed on the polymer film and on the flexible printed circuit. A display driver integrated circuit may be mounted to the traces on the polymer film. The polymer film may form a U-shaped bend. The flexible printed circuit may be coupled to a printed circuit board in the device using hot bar solder connections.


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