The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

May. 31, 2016
Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventors:

Yuichi Otani, Kawasaki, JP;

Takuya Seino, Kawasaki, JP;

Assignee:

CANON ANELVA CORPORATION, Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); H01L 43/12 (2006.01); G01R 33/00 (2006.01); H01F 10/32 (2006.01); H01F 41/18 (2006.01); G01R 33/09 (2006.01); C23C 14/08 (2006.01); C23C 14/22 (2006.01); C23C 14/35 (2006.01); C23C 14/34 (2006.01); G11C 11/16 (2006.01); H01F 10/12 (2006.01); H01L 43/02 (2006.01); H01L 43/08 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
H01L 43/12 (2013.01); C23C 14/081 (2013.01); C23C 14/225 (2013.01); C23C 14/3407 (2013.01); C23C 14/352 (2013.01); G01R 33/00 (2013.01); G01R 33/0052 (2013.01); G01R 33/098 (2013.01); G11C 11/161 (2013.01); H01F 10/123 (2013.01); H01F 10/32 (2013.01); H01F 41/18 (2013.01); H01J 37/3426 (2013.01); H01J 37/3435 (2013.01); H01J 37/3476 (2013.01); H01L 43/02 (2013.01); H01L 43/08 (2013.01); H01L 43/10 (2013.01);
Abstract

A method includes: a first film formation process forming a film by sputtering a first insulator target when a projection plane of the first insulator target on a plane including a front face of a substrate is in a first state; and a second film formation process forming a film by sputtering a second insulator target when a projection plane of the second insulator target formed on the plane including the front face of the substrate is in a second state different from the first state. The second film formation process provides the insulating film having a second characteristic variation having opposite tendency to a first characteristic variation in the film provided by the first film formation process, the first characteristic variation occurring from a center portion to a peripheral portion of the substrate, the second characteristic variation occurring at least partly from the center portion to the peripheral portion.


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