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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10361313 B1

PDFFull Text
Date of Patent:
Jul. 23, 2019

Filed:

Mar. 22, 2017

Electronic device and methods of fabricating the same

Applicant:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Inventors:

Doo Hyeb Youn, Sejong-si, KR;

Sun Jin Yun, Daejeon, KR;

Changbong Yeon, Namyangju-si, KR;

Young-Jun Yu, Daejeon, KR;

Assignee:

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Bo Fan

Int. Cl.
CPC ...
H01L 21/04 (2006.01); H01L 29/16 (2006.01); H01L 29/24 (2006.01); H01L 29/45 (2006.01); H01L 29/66 (2006.01); H01L 21/445 (2006.01); H01L 29/772 (2006.01); H01L 29/786 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78618 (2013.01); H01L 21/043 (2013.01); H01L 21/445 (2013.01); H01L 21/47635 (2013.01); H01L 29/1606 (2013.01); H01L 29/24 (2013.01); H01L 29/45 (2013.01); H01L 29/66045 (2013.01); H01L 29/66742 (2013.01); H01L 29/66969 (2013.01); H01L 29/772 (2013.01); H01L 29/78684 (2013.01); H01L 29/78696 (2013.01);
Abstract

Disclosed are an electronic device and a method of fabricating the same. The method of fabricating an electronic device comprises providing on a substrate a channel layer including a two-dimensional material, providing a metal fiber layer on a first surface of a conductive layer, providing the metal fiber layer on the channel layer, and performing a thermal treatment process to form a junction layer where a portion of the metal fiber layer is covalently bonded to a portion of the channel layer.

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