The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Feb. 14, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventor:

Tsutomu Kiyosawa, Toyama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7805 (2013.01); H01L 29/0696 (2013.01); H01L 29/086 (2013.01); H01L 29/1045 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/41741 (2013.01); H01L 29/41766 (2013.01); H01L 29/42368 (2013.01); H01L 29/66068 (2013.01); H01L 29/7801 (2013.01); H01L 29/7802 (2013.01); H01L 29/7827 (2013.01); H01L 29/7828 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor epitaxial wafer includes a semiconductor wafer, and a semiconductor layer of a first conductivity type disposed on a main surface of the semiconductor wafer. The semiconductor epitaxial wafer includes a plurality of device regions. The plurality of device regions each include a body region of a second conductivity type in contact with the semiconductor layer, a source region of the first conductivity type in contact with the body region, and a channel layer that is constituted by a semiconductor, and that is disposed on the semiconductor layer so as to be in contact with at least a part of the body region. In a plane parallel to the main surface of the semiconductor wafer, a thickness distribution in the channel layer and a concentration distribution of the first conductivity type impurity in the channel layer are negatively correlated to each other.


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