The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Mar. 21, 2018
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Inventors:

Shunpei Yamazaki, Tokyo, JP;

Masahiro Katayama, Tochigi, JP;

Shingo Eguchi, Tochigi, JP;

Yoshiaki Oikawa, Tochigi, JP;

Ami Nakamura, Tochigi, JP;

Satoshi Seo, Kanagawa, JP;

Kaoru Hatano, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); H05B 33/02 (2006.01); H05B 33/04 (2006.01); H05B 33/12 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3246 (2013.01); H01L 51/524 (2013.01); H01L 51/5253 (2013.01); H05B 33/02 (2013.01); H05B 33/04 (2013.01); H05B 33/12 (2013.01); H01L 27/1214 (2013.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01); H01L 29/7869 (2013.01); H01L 51/003 (2013.01); H01L 51/52 (2013.01); H01L 2251/5338 (2013.01);
Abstract

Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element faulted over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.


Find Patent Forward Citations

Loading…