The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jun. 05, 2017
Applicant:

Sionyx, Llc, Beverly, MA (US);

Inventors:

Homayoon Haddad, Beaverton, OR (US);

Jeffrey McKee, Tualatin, OR (US);

Jutao Jiang, Tigard, OR (US);

Chintamani Palsule, Lake Oswego, OR (US);

Leonard Forbes, Corvallis, OR (US);

Assignee:

SiOnyx, LLC, Beverly, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/148 (2006.01); H01L 27/146 (2006.01); H01L 31/0352 (2006.01); H01L 31/0232 (2014.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14629 (2013.01); H01L 27/1461 (2013.01); H01L 27/1462 (2013.01); H01L 27/1464 (2013.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01); H01L 31/0232 (2013.01); H01L 31/0236 (2013.01); H01L 31/0352 (2013.01);
Abstract

Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager device can include a semiconductor substrate having multiple doped regions forming a least one junction, a textured region coupled to the semiconductor substrate and positioned to interact with electromagnetic radiation, and a passivation region positioned between the textured region and the at least one junction. The passivation region is positioned to isolate the at least one junction from the textured region, and the semiconductor substrate and the textured region are positioned such that incoming electromagnetic radiation passes through the semiconductor substrate before contacting the textured region. Additionally, the device includes an electrical transfer element coupled to the semiconductor substrate to transfer an electrical signal from the at least one junction.


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