The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Dec. 23, 2014
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 27/01 (2006.01); H01G 4/30 (2006.01); H01G 4/33 (2006.01); H01C 1/14 (2006.01); H01C 1/142 (2006.01); H01C 7/00 (2006.01); H01C 17/00 (2006.01); H01G 4/012 (2006.01); H05K 1/16 (2006.01); H01L 27/08 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/016 (2013.01); H01C 1/14 (2013.01); H01C 1/142 (2013.01); H01C 7/003 (2013.01); H01C 7/006 (2013.01); H01C 17/006 (2013.01); H01G 4/012 (2013.01); H01G 4/30 (2013.01); H01G 4/33 (2013.01); H01L 27/0802 (2013.01); H01L 27/0805 (2013.01); H01L 28/20 (2013.01); H01L 28/60 (2013.01); H05K 1/167 (2013.01); Y10T 29/49158 (2015.01);
Abstract
The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode.