The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Oct. 30, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Lawrence A. Clevenger, LaGrangeville, NY (US);

Roger A. Quon, Rhinebeck, NY (US);

Terry A. Spooner, Clifton Park, NY (US);

Wei Wang, Yorktown Heights, NY (US);

Chih-Chao Yang, Glenmont, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/31116 (2013.01); H01L 21/76805 (2013.01); H01L 21/76814 (2013.01); H01L 21/76826 (2013.01); H01L 21/76831 (2013.01); H01L 21/76849 (2013.01); H01L 21/76879 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H01L 23/5329 (2013.01); H01L 23/53204 (2013.01); H01L 23/53238 (2013.01); H01L 23/53295 (2013.01);
Abstract

Methods of forming vias include nitridizing exposed surfaces of a first layer and an exposed surface of a conductor underlying the first layer to form a layer of nitridation at said exposed surfaces. Material from the layer of nitridation at the exposed surface of the underlying conductor is etched away. The exposed surface of the underlying conductor is etched away to form a recessed area in the underlying conductor after etching away material from the layer of nitridation. A conductive via that forms a conductive contact with the underlying conductor is formed.


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