The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Apr. 09, 2015
Applicant:

Nidec Sankyo Corporation, Suwa-gun, Nagano, JP;

Inventors:

Kazuhiro Gomi, Nagano, JP;

Ikuro Kuribayashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 21/86 (2013.01); G06K 7/08 (2006.01); G06K 7/10 (2006.01); G06K 7/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G06F 21/86 (2013.01); G06K 7/00 (2013.01); G06K 7/087 (2013.01); G06K 7/10009 (2013.01); H05K 1/0275 (2013.01); H05K 1/0219 (2013.01); H05K 2201/09345 (2013.01);
Abstract

Provided is a printed circuit board having a breakdown detection pattern formed thereon for preventing illicit acquisition of sensitive data, the printed circuit board being configured so that false detection of a disconnection or a short in the breakdown detection pattern can be prevented. The printed circuit board comprises a breakdown detection pattern layer wherein a breakdown detection pattern is formed for detecting a disconnection and/or a shorting thereof, a first pattern layer disposed more to a Y1 direction side than the breakdown detection pattern layer, a second pattern layer disposed more to a Y2 direction side than the breakdown detection pattern layer, and signal pattern layers disposed more to the Y2 direction side than the second pattern layer. Formed in the first pattern layer are a grounding pattern and a power source pattern covering the breakdown detection pattern from the Y1 direction side. Formed in the second pattern layer are a grounding pattern and a power source pattern covering the breakdown detection pattern from the Y2 direction side.


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