The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Jan. 15, 2016
International Business Machines Corporation, Armonk, NY (US);
Susan E. Cellier, Hopewell Junction, NY (US);
Lewis W. Dewey, III, Wappingers Falls, NY (US);
Anthony D. Hagin, Hopewell Junction, NY (US);
Adam P. Matheny, Beacon, NY (US);
Ron D. Rose, Essex Junction, VT (US);
David J. Widiger, Pflugerville, TX (US);
Patrick M. Williams, Salt Point, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A computer-implemented method for extracting a capacitance for a target wire of an integrated circuit includes receiving a design of the integrated circuit having a plurality of wiring layers and selecting a target wire to perform the capacitance extraction. The method further includes determining a first adjacent wiring layer and a second adjacent wiring layer and removing a first subset and a second subset of a plurality of non-adjacent wiring layers from the plurality of wiring layers. The method includes approximating a first plate to be used in the extraction based on the first subset of the plurality of non-adjacent wiring layers and approximating a second plate to be used in the extraction based on the second subset of the plurality of non-adjacent wiring layers and performing the extraction of the target wire based on the first and second adjacent wiring layers and the first and second plates.