The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Sep. 19, 2016
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Andrew E. Winter, Bellevue, WA (US);

Brian Rush Cox, Seattle, WA (US);

Launnie K E Ginn, Kent, WA (US);

David Otto Whitt, Sammamish, WA (US);

Aric A. Fitz-Coy, Seattle, WA (US);

Carl E. Picciotto, Clyde Hill, WA (US);

Gahn Gavyn Yun, Bellevue, WA (US);

John Jacob Nelson, Redmond, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/01 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); G06F 3/0354 (2013.01);
U.S. Cl.
CPC ...
G06F 3/016 (2013.01); G06F 3/03547 (2013.01); G06F 3/044 (2013.01); G06F 3/0414 (2013.01);
Abstract

Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism.


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