The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Aug. 30, 2017
Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Rik Jonckheere, Muizen, BE;

Koen D'have, Leuven, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 1/22 (2012.01); G03F 1/42 (2012.01); G03F 1/54 (2012.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
G03F 1/22 (2013.01); G03F 1/42 (2013.01); G03F 1/54 (2013.01); H01L 21/682 (2013.01);
Abstract

The disclosure is related to a lithographic mask for EUV lithography, to a method for producing the mask, to a method for printing a pattern with the mask, to a stepper/scanner configured to print a pattern with the mask as well as to a computer-implemented method for calculating a deformation of the pattern. The mask comprises an absorber pattern, which is intentionally deformed in the 2-dimensional plane of the EUV mask, with respect to the intended pattern. The deformation of the pattern is based on a previous measurement of the location of multilayer defects on the blank, and calculated so that in the deformed pattern, a maximum of multilayer defects are covered by absorber material. When the pattern is subsequently printed on a semiconductor wafer in a stepper/scanner, the scanner operation is modulated so that the pattern deformation is not reproduced on the wafer.


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