The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Feb. 28, 2017
Applicant:
Omnivision Technologies, Inc., Santa Clara, CA (US);
Inventors:
George Barnes, Westminster, CO (US);
Goran Rauker, Longmont, CO (US);
Assignee:
OmniVision Technologies, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 13/00 (2006.01); G03F 7/09 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); G03F 7/30 (2006.01); G03F 7/38 (2006.01); G03F 7/16 (2006.01); G03F 7/004 (2006.01); G02B 3/00 (2006.01); G03F 7/00 (2006.01); G03F 7/11 (2006.01); G03F 7/038 (2006.01); G03F 7/095 (2006.01); G02B 7/00 (2006.01);
U.S. Cl.
CPC ...
G02B 13/0085 (2013.01); G02B 3/0031 (2013.01); G02B 3/0056 (2013.01); G02B 3/0068 (2013.01); G02B 3/0075 (2013.01); G02B 7/003 (2013.01); G03F 7/00 (2013.01); G03F 7/0005 (2013.01); G03F 7/0045 (2013.01); G03F 7/038 (2013.01); G03F 7/092 (2013.01); G03F 7/0957 (2013.01); G03F 7/11 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/30 (2013.01); G03F 7/38 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/265 (2015.01); Y10T 428/31504 (2015.04); Y10T 428/31511 (2015.04);
Abstract
A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at least one wafer-level camera element. The layer photoresist is developed, such that the layer of photoresist is the spacer wafer for the wafer-level camera.