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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10359338 B1

PDFFull Text
Date of Patent:
Jul. 23, 2019

Filed:

Dec. 15, 2014

Assessing integrity of bonded joints

Applicant:

Bae Systems Plc, London, GB;

Inventor:

Ian James Read, Bristol, GB;

Assignee:

BAE Systems plc, London, GB;

Attorney:

Maine Cernota & Rardin

Primary Examiner:

Sung H Pak

Assistant Examiner:

Hoang Q Tran

Int. Cl.
CPC ...
G02B 6/36 (2006.01); G01M 11/08 (2006.01); B29C 65/50 (2006.01); B64D 45/00 (2006.01); B29L 11/00 (2006.01); B29C 65/48 (2006.01); B29C 65/00 (2006.01); B29L 31/08 (2006.01); B29L 31/30 (2006.01); B64C 1/00 (2006.01); B29C 65/82 (2006.01);
U.S. Cl.
CPC ...
G01M 11/086 (2013.01); B29C 65/50 (2013.01); B64D 45/00 (2013.01); G02B 6/3644 (2013.01); B29C 65/48 (2013.01); B29C 65/4835 (2013.01); B29C 65/82 (2013.01); B29C 66/1122 (2013.01); B29C 66/45 (2013.01); B29C 66/50 (2013.01); B29C 66/69 (2013.01); B29C 66/721 (2013.01); B29L 2011/0075 (2013.01); B29L 2031/085 (2013.01); B29L 2031/3076 (2013.01); B29L 2031/3082 (2013.01); B29L 2031/3085 (2013.01); B64C 2001/0072 (2013.01); B64D 2045/0085 (2013.01); Y02P 70/523 (2015.11);
Abstract

There is provided apparatus and a method for assessing the integrity of a bonded joint and a bonded joint assembly. The assembly has a bonded joint monitored for bond integrity and comprises first () and second () components each defining a bonding surface (); the joint () is formed between the bonding surfaces () and the first component () defines a passage () therethrough from the bonding surface to an exterior of the component. The joint () includes an optical fiber () extending along the joint () between the bonding surfaces, through the passage () and emerging from the passage () to the exterior of the component. The method of constructing the assembly includes the steps of passing the optical fiber () through the passage () and adhering the optical fiber () to the bonding surface () of the first component (), thus bringing the two bonding surfaces () together and forming the bond ().

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