The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Sep. 26, 2017
Applicant:

Koito Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Atsushi Ozawa, Shizuoka, JP;

Yoshimasa Murata, Shizuoka, JP;

Takuya Serita, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 45/48 (2018.01); F21V 19/00 (2006.01); F21V 29/76 (2015.01); F21V 17/10 (2006.01); F21V 23/06 (2006.01); F21K 9/90 (2016.01); F21S 43/19 (2018.01); F21S 43/14 (2018.01); F21Y 115/10 (2016.01); F21V 29/70 (2015.01); F21S 45/50 (2018.01);
U.S. Cl.
CPC ...
F21V 19/003 (2013.01); F21K 9/90 (2013.01); F21S 43/14 (2018.01); F21S 43/19 (2018.01); F21S 43/195 (2018.01); F21S 45/48 (2018.01); F21V 17/101 (2013.01); F21V 23/06 (2013.01); F21V 29/763 (2015.01); F21S 45/50 (2018.01); F21V 29/70 (2015.01); F21Y 2115/10 (2016.08);
Abstract

A light source unit includes a board, a resin-molded unit formed using a resin material as a base material and having thermal conductivity, and a socket housing including a heat sink formed of a metal material, and a board attachment portion to which the board is attached and a covered surface which is covered with the resin-molded unit, wherein the resin-molded unit is formed with a holding hole communicating with the covered surface, and the heat sink and the resin-molded unit are formed by integral molding when a portion of the covered surface and a portion of the attachment surface are pressed by a portion of a mold inserted through the holding hole and another portion of the mold, respectively.


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