The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Nov. 20, 2015
Applicant:

Smith International, Inc., Houston, TX (US);

Inventors:

Yahua Bao, Orem, UT (US);

Fulong Wang, Pleasant Grove, UT (US);

J. Daniel Belnap, Lindon, UT (US);

Ronald K. Eyre, Orem, UT (US);

Yi Fang, Orem, UT (US);

Assignee:

SMITH INTERNATIONAL, INC., Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/14 (2006.01); C22C 1/10 (2006.01); C22C 26/00 (2006.01); E21B 10/573 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
C22C 26/00 (2013.01); B22F 3/14 (2013.01); B22F 5/00 (2013.01); C22C 1/1036 (2013.01); E21B 10/5735 (2013.01); B22F 2005/001 (2013.01); B22F 2302/406 (2013.01); C22C 2026/006 (2013.01);
Abstract

A method of forming a polycrystalline diamond cutting element includes assembling a diamond material, a substrate, and a source of catalyst material or infiltrant material distinct from the substrate, the source of catalyst material or infiltrant material being adjacent to the diamond material to form an assembly. The substrate includes an attachment material including a refractory metal. The assembly is subjected to a first high-pressure/high temperature condition to cause the catalyst material or infiltrant material to melt and infiltrate into the diamond material and subjected to a second high-pressure/high temperature condition to cause the attachment material to melt and infiltrate a portion of the infiltrated diamond material to bond the infiltrated diamond material to the substrate.


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