The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Jun. 06, 2014
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Kojiro Akiba, Tokyo, JP;

Yusuke Kondo, Tokyo, JP;

Yoshitaka Kikuchi, Tokyo, JP;

Satoshi Kato, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/46 (2006.01); C22C 38/02 (2006.01); C22C 38/06 (2006.01); C22C 38/12 (2006.01); C22C 38/58 (2006.01); C25D 3/22 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01); C21D 8/04 (2006.01); C21D 9/48 (2006.01); C21D 9/56 (2006.01); C21D 1/673 (2006.01); B21D 22/00 (2006.01); C21D 6/00 (2006.01); C21D 8/02 (2006.01); C22C 38/00 (2006.01); C22C 38/04 (2006.01); C22C 38/08 (2006.01); C22C 38/14 (2006.01); C22C 38/22 (2006.01); C22C 38/32 (2006.01); C22C 38/38 (2006.01); C25D 5/36 (2006.01); C25D 5/48 (2006.01); C25D 7/00 (2006.01);
U.S. Cl.
CPC ...
C21D 9/46 (2013.01); B21D 22/00 (2013.01); C21D 1/673 (2013.01); C21D 6/004 (2013.01); C21D 6/005 (2013.01); C21D 6/008 (2013.01); C21D 8/0205 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C21D 8/0263 (2013.01); C21D 8/0278 (2013.01); C21D 8/0473 (2013.01); C21D 9/48 (2013.01); C21D 9/561 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/22 (2013.01); C22C 38/32 (2013.01); C22C 38/38 (2013.01); C22C 38/58 (2013.01); C25D 3/22 (2013.01); C25D 5/36 (2013.01); C25D 5/48 (2013.01); C25D 5/50 (2013.01); C25D 7/00 (2013.01); C25D 7/0614 (2013.01);
Abstract

A hot stamp molded body that can be produced highly efficiently without causing sticking of plating to a mold, when an electrogalvanized steel sheet with a light plating weight is hot-stamped using a rapidly heating method such as Joule heating and induction heating, and can secure favorable paint adhesiveness without a posttreatment such as shotblasting after hot stamping, as well as a method for producing the same. A hot stamp molded body is produced by hot-stamping an electrogalvanized steel sheet which is composed of predetermined components, and is electrogalvanized on each face with a plating weight not less than 5 g/mand less than 40 g/m; and therein a galvanized layer of the hot stamp molded body is configured with 0 g/mto 15 g/mof a Zn—Fe intermetallic compound and a Fe—Zn solid solution phase as a balance, and in the galvanized layer of the hot stamp molded body 1×10 pcs to 1×10pcs of particulate matter with an average diameter of from 10 nm to 1 μm are present per 1 mm length of the galvanized layer.


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