The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 23, 2019

Filed:

Aug. 17, 2017
Applicant:

Few Fahrzeugelektrik Werk Gmbh & Co. KG, Zwenkau, DE;

Inventors:

Roy Gleisberg, Markranstädt, DE;

Björn Schneider, Markkleeberg, DE;

André Jenrich, Leipzig, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 1/00 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); C03C 27/04 (2006.01); B23K 1/19 (2006.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01); B23K 35/30 (2006.01); B23K 101/38 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0006 (2013.01); B23K 1/19 (2013.01); B23K 35/001 (2013.01); B23K 35/0238 (2013.01); C03C 27/04 (2013.01); B23K 35/3033 (2013.01); B23K 2101/36 (2018.08); B23K 2101/38 (2018.08); B23K 2103/172 (2018.08); B23K 2103/54 (2018.08);
Abstract

The invention relates to a method for forming a bonded joint between a structure that is applied to a glass substrate, in particular a printed conductive structure and an electrical connecting component, in particular a solder base by using solder coated or non-solder coated reactive nanometer multilayer foils which are made from at least two exothermally reacting materials. Initially preconfiguring the reactive nanometer multilayer foils according to the opposing joining surfaces of the conductive structure and the electrical closure element is performed. Thereafter arranging a solder preform respectively between the respective joining surface and the nanometer multilayer foil for non-solder coated foils or arranging an additional solder preform for already solder coated nanometer multilayer foils is performed, wherein the solder preform or the additional solder preform includes a larger, in particular double thickness layer compared to another solder preform between the nanometer multilayer foil and the a conductive structure applied to the glass substrate so that a reduction of the temperature introduction into the conductive structure and a leveling of uneven portions is caused. After temporarily applying a pressure force which is applied between the joining surfaces triggering the exothermal reaction of the nanometer multilayer foil is performed by an electrical impulse or a laser impulse.


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