The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Oct. 21, 2016
Applicant:
Raytheon Company, Waltham, MA (US);
Inventors:
Patrick J. Kocurek, Allen, TX (US);
Sankerlingam Rajendran, Plano, TX (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4626 (2013.01); H05K 3/0055 (2013.01); H05K 3/30 (2013.01); H05K 3/4038 (2013.01); H05K 3/4632 (2013.01); H05K 3/4697 (2013.01); H05K 1/185 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/065 (2013.01);
Abstract
A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements.