The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Oct. 30, 2018
Applicant:

Japan Aviation Electronics Industry, Limited, Tokyo, JP;

Inventor:

Kentaro Toda, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01R 12/53 (2011.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0222 (2013.01); H05K 1/0228 (2013.01); H01R 12/53 (2013.01); H01R 12/722 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09272 (2013.01); H05K 2201/09618 (2013.01);
Abstract

A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.


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