The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Aug. 27, 2018
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Eiichiro Dobashi, Kumamoto, JP;

Shuichi Mochinaga, Kumamoto, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H01L 27/146 (2006.01); G02B 7/02 (2006.01); G02B 7/00 (2006.01); G03B 17/08 (2006.01); G03B 11/00 (2006.01); G02B 5/20 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); G02B 5/208 (2013.01); G02B 7/006 (2013.01); G02B 7/021 (2013.01); G03B 11/00 (2013.01); G03B 17/08 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14625 (2013.01); H01L 27/14685 (2013.01); H04N 5/2253 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/16151 (2013.01); H01L 2924/16152 (2013.01);
Abstract

The present technology relates to an imaging device, a manufacturing device, and a manufacturing method that enable a reliable manufacturing device to be manufactured without an increase in the number of manufacturing steps. A substrate on which an image sensor is mounted, a frame that fixes an infrared cut filter (IRCF), and a unit including a lens are included. The image sensor is sealed by the substrate, the IRCF, and the frame. A vent connected to a space in which the image sensor is sealed is provided in a part of the frame. The vent is blocked by a member that bonds the unit and the frame together. The vent is provided in the frame, in a predetermined shape, and in a vertical direction with respect to a surface to which the member is applied. The present technology can be applied to the imaging device.


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