The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Sep. 06, 2017
Applicant:

Oclaro Japan, Inc., Sagamihara, Kanagawa, JP;

Inventors:

Kouji Nakahara, Tokyo, JP;

Takeshi Kitatani, Tokyo, JP;

Assignee:

Oclaro Japan, Inc., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/12 (2006.01); H01S 5/227 (2006.01); H01S 5/24 (2006.01); H01S 5/343 (2006.01); G02B 6/42 (2006.01); H01S 5/022 (2006.01); H01S 5/028 (2006.01); H01S 5/20 (2006.01); H01S 5/22 (2006.01); H01S 5/32 (2006.01);
U.S. Cl.
CPC ...
H01S 5/227 (2013.01); G02B 6/42 (2013.01); H01S 5/2275 (2013.01); H01S 5/24 (2013.01); H01S 5/343 (2013.01); H01S 5/34306 (2013.01); H01S 5/0287 (2013.01); H01S 5/02284 (2013.01); H01S 5/02288 (2013.01); H01S 5/12 (2013.01); H01S 5/2009 (2013.01); H01S 5/222 (2013.01); H01S 5/2214 (2013.01); H01S 5/2224 (2013.01); H01S 5/2226 (2013.01); H01S 5/3213 (2013.01); H01S 2301/166 (2013.01);
Abstract

Provided is an optical semiconductor device which has long-term reliability since a threshold current is small, and a relaxation oscillation frequency is high. An optical semiconductor device includes an InP semiconductor substrate, a lower mesa structure that is disposed above the InP semiconductor substrate, and includes a multiple quantum well layer, an upper mesa structure that is disposed on the lower mesa structure, and includes a cladding layer, a buried semiconductor layer that buries both side surfaces of the lower mesa structure, and an insulating film that covers both side surfaces of the upper mesa structure by being in contact with both side surfaces of the upper mesa structure, in which the lower mesa structure includes a first semiconductor layer, above the multiple quantum well layer, and the upper mesa structure includes a second semiconductor layer which is different from the cladding layer in composition, below the cladding layer.


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