The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Mar. 03, 2017
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

James David Holbery, Bellevue, WA (US);

Siyuan Ma, Bothell, WA (US);

Flavio Protasio Ribeiro, Bellevue, WA (US);

Michael David Dickey, Redmond, WA (US);

Collin Alexander Ladd, Sammamish, WA (US);

Andrew Lewis Fassler, Seattle, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 3/08 (2006.01); H01R 12/61 (2011.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 3/28 (2006.01); H05K 3/10 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01R 3/08 (2013.01); H01L 23/4985 (2013.01); H01L 23/49866 (2013.01); H01L 24/69 (2013.01); H01L 24/89 (2013.01); H01R 12/613 (2013.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 3/10 (2013.01); H05K 3/28 (2013.01); H05K 3/34 (2013.01); H01L 23/5389 (2013.01); H05K 2201/05 (2013.01); H05K 2201/10977 (2013.01);
Abstract

Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.


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