The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Dec. 11, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Yukiko Oshima, Anan, JP;

Yoshiki Sato, Anan, JP;

Toshiyuki Okazaki, Tokushima, JP;

Takayoshi Wakaki, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/64 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/644 (2013.01); H01L 33/486 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.


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