The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2019

Filed:

Nov. 17, 2017
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Ryo Kajitani, Osaka, JP;

Daisuke Shibata, Kyoto, JP;

Kenichiro Tanaka, Osaka, JP;

Satoshi Tamura, Osaka, JP;

Masahiro Ishida, Osaka, JP;

Tetsuzo Ueda, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 29/862 (2006.01); H01L 29/872 (2006.01); H01L 29/06 (2006.01); H01L 29/12 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/417 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 27/15 (2006.01); H01L 33/20 (2010.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 29/47 (2006.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 29/862 (2013.01); H01L 27/15 (2013.01); H01L 29/0619 (2013.01); H01L 29/0661 (2013.01); H01L 29/0692 (2013.01); H01L 29/122 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/402 (2013.01); H01L 29/417 (2013.01); H01L 29/66212 (2013.01); H01L 29/872 (2013.01); H01L 33/20 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/30612 (2013.01); H01L 29/475 (2013.01); H01L 33/38 (2013.01);
Abstract

A nitride semiconductor device includes: a substrate having a first major surface and a second major surface; a first nitride semiconductor layer of an n-type which is disposed on the first major surface and has a protrusion; a second nitride semiconductor layer of a p-type disposed on the protrusion; a first anode electrode disposed above the first nitride semiconductor layer and the second nitride semiconductor layer; and a cathode electrode disposed under the second major surface, and a lateral surface of the protrusion is inclined by a first angle with respect to the first major surface.


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