The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Feb. 12, 2018
Applicant:
Raytheon Company, Waltham, MA (US);
Inventor:
James E. Faoro, Tucson, AZ (US);
Assignee:
RAYTHEON COMPANY, Waltham, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/065 (2006.01); H01L 23/538 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/3675 (2013.01); H01L 23/5389 (2013.01); H01L 25/50 (2013.01); H01L 2225/06589 (2013.01);
Abstract
A three-dimensional (3D) circuit card assembly includes a substrate package and a passive heat transfer unit. The substrate package includes a plurality of individual substrates stacked atop one another. The passive heat transfer unit includes at least one intermediate heat dissipation plate configured to receive heat from the substrate package, and a thermally conductive dissipation cover configured to dissipate the heat received from the at least one intermediate heat dissipation plate away from the 3D circuit card assembly.