The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2019
Filed:
Mar. 20, 2018
Ablic Inc., Chiba-shi, Chiba, JP;
Noriyuki Kimura, Chiba, JP;
ABLIC Inc., , JP;
Abstract
The resin-encapsulated semiconductor device includes a bump electrode () formed on an element surface side of a semiconductor chip (), a conductive layer () electrically connected to the bump electrode (), and a resin encapsulation body () covering the semiconductor chip (), the bump electrode (), and the conductive layer (). On a back surface of the semiconductor chip () that is flush with a back surface of the resin encapsulation body (), a metal layer () and a laminated film () are formed. The laminated film () is formed on a front surface of the conductive layer (). The external terminal () is arranged on an inner side of an outer edge of the semiconductor chip ().